US 12,304,004 B2
Multi-step method for machining blind opening in ceramic component
Robin H. Fernandez, Litchfield, CT (US); John D. Riehl, Hebron, CT (US); and Zachary P. Konopaske, West Hartford, CT (US)
Assigned to RTX CORPORATION, Farmington, CT (US)
Filed by RTX CORPORATION, Farmington, CT (US)
Filed on Aug. 30, 2022, as Appl. No. 17/898,692.
Claims priority of provisional application 63/240,491, filed on Sep. 3, 2021.
Prior Publication US 2023/0070114 A1, Mar. 9, 2023
Int. Cl. B23K 26/386 (2014.01); B23K 26/00 (2014.01); B23K 26/146 (2014.01); B23K 101/00 (2006.01); B23K 103/00 (2006.01)
CPC B23K 26/386 (2013.01) [B23K 26/0093 (2013.01); B23K 26/146 (2015.10); B23K 2101/001 (2018.08); B23K 2103/52 (2018.08)] 7 Claims
OG exemplary drawing
 
7. A method of machining comprising:
removing material from a target region of a ceramic component to form a blind opening in the ceramic component by:
(i) removing a bulk of the material by a laser machining operation, and
(ii) after (i), removing a remainder of the material by a mechanical machining operation, wherein the laser machining operation in (i) removes at least 75% of the material.