US 12,304,002 B2
Laser-cutting using selective polarization
Ruslan Rifovich Subkhangulov, Nijmegen (NL); Paul Christiaan Verburg, Nijmegen (NL); Denis Danisovich Arslanov, Utrecht (NL); and Roman Urs Doll, Nijmegen (NL)
Assigned to ASMPT SINGAPORE PTE. LTD., (SG)
Filed by ASMPT SINGAPORE PTE. LTD., Singapore (SG)
Filed on Sep. 23, 2021, as Appl. No. 17/482,566.
Application 17/482,566 is a division of application No. 15/820,782, filed on Nov. 22, 2017, abandoned.
Prior Publication US 2022/0009035 A1, Jan. 13, 2022
Int. Cl. B23K 26/364 (2014.01); B23K 26/06 (2014.01); B23K 26/064 (2014.01); B23K 26/38 (2014.01); B23K 103/00 (2006.01)
CPC B23K 26/364 (2015.10) [B23K 26/064 (2015.10); B23K 26/0643 (2013.01); B23K 26/38 (2013.01); B23K 2103/56 (2018.08)] 6 Claims
OG exemplary drawing
 
1. A method of cutting a semiconductor wafer, comprising the steps of:
a) providing a laser source for directing laser light to an irradiation region of a laser cutting apparatus,
b) supporting the semiconductor wafer within the laser cutting apparatus such that the irradiation region is coincident with a point on a cut line of the semiconductor wafer,
c) cutting the semiconductor wafer along the cut line by irradiating the irradiation region of the semiconductor wafer with laser light having a first polarization state and relatively moving the semiconductor wafer and the irradiation region in a direction parallel to the plane of the semiconductor wafer such that the irradiation region follows the cut line of the wafer, so that the semiconductor wafer is cut along the cut line to form a groove; and
annealing the cut semiconductor wafer by subsequently irradiating the irradiation region of the semiconductor wafer with laser light having a second polarization state that is different from the first polarization state and relatively moving the semiconductor wafer and the irradiation region in a direction parallel to the plane of the semiconductor wafer such that the irradiation region follows the cut line of the wafer, so that the semiconductor wafer is annealed along the cut line.