US 12,303,976 B2
Additive manufacturing device
Hakan Yavas, Ankara (TR); and Ahmet Alptug Tanrikulu, Ankara (TR)
Assigned to TUSAS- TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI, Kahramankazan/Ankara (TR)
Appl. No. 17/633,503
Filed by TUSAS-TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI, Kahramankazan/Ankara (TR)
PCT Filed Aug. 25, 2020, PCT No. PCT/TR2020/050750
§ 371(c)(1), (2) Date Feb. 7, 2022,
PCT Pub. No. WO2021/040656, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019/13132 (TR), filed on Aug. 29, 2019.
Prior Publication US 2022/0288687 A1, Sep. 15, 2022
Int. Cl. B22F 10/20 (2021.01); B22F 10/28 (2021.01); B22F 10/50 (2021.01); B22F 12/00 (2021.01); B22F 12/70 (2021.01); B22F 12/90 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B22F 10/36 (2021.01)
CPC B22F 12/222 (2021.01) [B22F 10/28 (2021.01); B22F 10/50 (2021.01); B22F 12/70 (2021.01); B22F 12/90 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B22F 10/36 (2021.01); B22F 2202/05 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An additive manufacturing device comprising:
a body;
a table which is located on the body and allows powders to be laid thereon by a laying apparatus;
at least one layer which is created by sintering or fusing the powders laid on the table;
a part which is produced by depositing the layers using additive manufacturing;
a heat source assembly which is located on the body and applies heat treatment to the powders laid on the table;
a first sensor for measuring a position and an operating status of the heat source assembly;
a control unit controlling the heat source assembly based on data received from the first sensor;
a coating applied on the at least one layer by magnetic sputtering;
a target material which allows atoms of the coating to be removed from a surface thereof when a process gas is collided onto the target material;
a magnetic sputtering assembly which is located on the body and is triggered by the control unit so that the coating is applied on the at least one layer by magnetic sputtering;
a positioner configured to position the magnetic sputtering assembly at different angles;
a magnetic sputtering body housing the target material and the positioner;
at least one adapter which is located on the body so that the magnetic sputtering assembly moves on the body;
wherein a first end of the positioner is attached to the adapter and a second end thereof is attached to the magnetic sputtering body, wherein the positioner is configured to locate the magnetic sputtering assembly at a desired position and/or angle with respect to the table by moving along a south pole of a magnet in the magnetic supporting body; and
wherein the magnetic sputtering assembly is configured so that the coating is applied by colliding the process gas onto the target material, removing atoms of the coating from the surface of the target material and depositing them on at least one layer, wherein the process gas becomes a high-energy positive ion by losing its electron as a result of colliding with free electrons moving in the magnetic field between the north pole and the south pole of the magnet.