| CPC B21D 28/14 (2013.01) [B21D 53/04 (2013.01); F28F 3/02 (2013.01)] | 10 Claims |

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1. A processing apparatus, comprising:
an upper die assembly comprising a first cutter, wherein the first cutter comprises a first cutting edge portion;
a lower die assembly disposed opposite to the upper die assembly, wherein the lower die assembly comprises a second cutter and a lower die plate, the lower die plate has an upper end portion facing the upper die assembly, the second cutter is fixedly connected to the upper end portion and the second cutter comprises a second cutting edge portion higher than the upper end portion, wherein a distance between the second cutting edge portion and the upper end portion is denoted as H, and a value range of H is 0.1 mm≤H≤0.3 mm; and
a driving mechanism configured to enable the upper die assembly to move with respect to the lower die assembly so that the first cutting edge portion is interleaved with the second cutting edge portion.
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