	US 12,303,934 B2
	Method for manufacturing laminate
Masumi Morihara, Tagawa (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 18/016,019
Filed by SHOWA DENKO MATERIALS CO., LTD., Tokyo (JP)
PCT Filed Jul. 17, 2020, PCT No. PCT/JP2020/027896 § 371(c)(1), (2) Date Jan. 13, 2023, PCT Pub. No. WO2022/014050, PCT Pub. Date Jan. 20, 2022.
Prior Publication US 2023/0278070 A1, Sep. 7, 2023
Int. Cl. B05D 1/38 (2006.01); B05D 5/12 (2006.01); B05D 7/24 (2006.01)

CPC B05D 1/38 (2013.01) [B05D 5/12 (2013.01); B05D 7/24 (2013.01)]

9 Claims

1. A method for manufacturing a laminate, the method comprising a process of forming a silver-particle layer on a substrate, the process comprising allowing an aqueous solution of ammoniacal silver nitrate to contact with an aqueous solution of a reducing agent, and the aqueous solution of the reducing agent comprising a phenol compound as the reducing agent, an alkaline substance and an amine compound, wherein the silver-particle layer has a surface resistivity of 10⁵Ω/□ or more.