US 11,985,762 B2
Flexible laminated board and multilayer circuit board
Eisuke Tachibana, Tokyo (JP); Taro Suzuki, Tokyo (JP); Makoto Totani, Kariya (JP); Kouji Kondoh, Kariya (JP); Eijirou Miyagawa, Kariya (JP); Junya Kasahara, Tokyo (JP); and Takao Arima, Tokyo (JP)
Assigned to UBE EXSYMO CO., LTD., Tokyo (JP)
Filed by UBE EXSYMO CO., LTD., Tokyo (JP)
Filed on Jan. 25, 2021, as Appl. No. 17/157,695.
Application 17/157,695 is a division of application No. 15/541,630, abandoned, previously published as PCT/JP2016/050709, filed on Jan. 12, 2016.
Claims priority of application No. 2015-004337 (JP), filed on Jan. 13, 2015; and application No. 2015-004338 (JP), filed on Jan. 13, 2015.
Prior Publication US 2021/0153348 A1, May 20, 2021
Int. Cl. B32B 15/08 (2006.01); B29C 43/48 (2006.01); B29C 48/88 (2019.01); B32B 3/08 (2006.01); B32B 7/04 (2019.01); B32B 7/06 (2019.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 15/098 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 27/42 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/10 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); B65G 15/12 (2006.01); H05K 3/06 (2006.01); H05K 3/22 (2006.01)
CPC H05K 1/0393 (2013.01) [B29C 48/9145 (2019.02); B32B 3/08 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 27/42 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/10 (2013.01); B32B 37/1027 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/022 (2013.01); H05K 3/4655 (2013.01); B29C 43/48 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/538 (2013.01); B32B 2307/546 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2307/748 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2405/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/20 (2013.01); B65G 15/12 (2013.01); H05K 3/067 (2013.01); H05K 3/227 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/068 (2013.01); H05K 2203/066 (2013.01); H05K 2203/1194 (2013.01); H05K 2203/1545 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method for manufacturing a flexible laminated sheet consisting of an insulation film formed of a liquid crystal polymer and a metal foil provided on one or both sides of the insulation film, the method comprising steps of:
continuously feeding the insulation film and the metal foil between a pair of two endless belts; and
thermocompression-bonding the insulation film onto the metal foil by applying heat and pressure to the insulation film and the metal foil between the endless belts to form a flexible laminated sheet, wherein
the step of thermocompression bonding comprises:
heating the flexible laminated sheet so that a maximum temperature of the flexible laminated sheet is in a range from a temperature that is 45° C. lower than a melting point of the liquid crystal polymer of the insulation film to a temperature that is 5° C. lower than the melting point, and
cooling the flexible laminated sheet under the pressure between the endless belts so that an exit temperature, which is a temperature of the flexible laminated sheet when transferred out of the endless belts, is in a range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer of the insulation film to a temperature that is 100° C. lower than the melting point.