US 11,985,758 B2
Indium-based interface structures, apparatus, and methods for forming the same
Matthew J. Spitzner, Lowry Crossing, TX (US); and Fernando Ortiz, Dallas, TX (US)
Assigned to L3 Technologies, Inc., New York, NY (US)
Filed by L3 Technologies, Inc., New York, NY (US)
Filed on Mar. 29, 2021, as Appl. No. 17/216,603.
Application 17/216,603 is a division of application No. 16/173,523, filed on Oct. 29, 2018, granted, now 10,973,114.
Prior Publication US 2021/0219417 A1, Jul. 15, 2021
Int. Cl. H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 3/3463 (2013.01); H05K 7/20481 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An assembly comprising:
a first surface;
a second surface; and
a solid indium-based material melted between and adhered to the first surface and the second surface;
where the second surface comprises separate individual external surfaces of multiple different spaced-apart components that are mounted to a substrate;
where the solid indium-based material has a first side in contact with the first surface, the first side of the solid indium-based material being mechanically adhered to the first surface without the presence of solder;
where the solid indium-based material has a second side having an upper surface;
where the multiple different spaced-apart components are displaced downward with their respective external surfaces into the upper surface of the second side of the solid indium-based material with each of the multiple different spaced-apart components only partially disposed within the solid indium-based material below the upper surface of the second side of the solid indium-based material and with their respective external surfaces disposed within the solid indium-based material below the upper surface of the second side of the solid indium-based material; and
where a gap exists between the second side of the indium-based material and the substrate.