US 11,985,463 B2
Headphones with increased back volume
Edward Siahaan, San Francisco, CA (US); Daniel R. Bloom, Alameda, CA (US); Jason J. LeBlanc, Castro Valley, CA (US); and Phillip Qian, Tokyo (JP)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by APPLE INC., Cupertino, CA (US)
Filed on May 15, 2023, as Appl. No. 18/197,672.
Application 18/197,672 is a continuation of application No. 17/804,274, filed on May 26, 2022, granted, now 11,700,471.
Application 17/804,274 is a continuation of application No. 16/878,565, filed on May 19, 2020, granted, now 11,375,306, issued on Jun. 28, 2022.
Application 16/878,565 is a continuation of application No. PCT/US2018/062143, filed on Nov. 20, 2018.
Claims priority of provisional application 62/588,801, filed on Nov. 20, 2017.
Prior Publication US 2023/0328418 A1, Oct. 12, 2023
Int. Cl. H04R 25/00 (2006.01); H04R 1/10 (2006.01); H04R 5/033 (2006.01); H04R 5/04 (2006.01); G10K 11/178 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 1/1033 (2013.01); H04R 1/1041 (2013.01); H04R 1/105 (2013.01); H04R 1/1066 (2013.01); H04R 1/1075 (2013.01); H04R 1/1083 (2013.01); H04R 5/0335 (2013.01); H04R 5/04 (2013.01); G10K 11/17861 (2018.01); G10K 11/17873 (2018.01)] 20 Claims
OG exemplary drawing
 
1. An earpiece suitable for use with headphones, the earpiece comprising:
an earpiece housing defining an interior volume having a central region surrounded by an annular region, the earpiece housing including a cover plate disposed over the central region and having a plurality of apertures formed there through;
an array of capacitive sensors disposed within the interior volume and coupled to the cover plate;
an annular earpad coupled to the earpiece housing and surrounding the plurality of apertures formed through the cover plate; and
an acoustic driver disposed within the interior volume and aligned to emit sound through the plurality of apertures formed in the cover plate.