US 11,985,441 B2
Methods and apparatus for an image sensor
Nicholas Paul Cowley, Wroughton (GB); and Andrew David Talbot, Chieveley (GB)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Aug. 19, 2022, as Appl. No. 17/821,052.
Application 17/821,052 is a continuation of application No. 17/249,578, filed on Mar. 5, 2021, granted, now 11,457,166.
Prior Publication US 2022/0408052 A1, Dec. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 25/71 (2023.01); H04N 25/76 (2023.01); H04N 25/779 (2023.01); H04N 25/79 (2023.01)
CPC H04N 25/745 (2023.01) [H04N 25/779 (2023.01); H04N 25/7795 (2023.01); H04N 25/79 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor, comprising:
a pixel array comprising a plurality of rows, wherein a first row comprises a first pixel group and a second pixel group, wherein the first pixel group has first and second opposing ends, and wherein the second pixel group has first and second opposing ends;
a first row driver circuit connected to the first end of the first pixel group;
a second row driver circuit connected to the second end of the second pixel group;
a first delay measurement circuit that has a first input connected directly to the first row driver circuit and a second input connected directly to a first node that is interposed between the first end of the first pixel group and the first row driver circuit; and
a second delay measurement circuit that has a first input connected directly to the second row driver circuit and a second input connected directly to a second node that is interposed between the second end of the second pixel group and the second row driver circuit.