US 11,985,437 B2
Readout architectures for binned indirect time-of-flight sensors
Andreas Suess, San Jose, CA (US); and Zheng Yang, San Jose, CA (US)
Assigned to OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed by OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US)
Filed on Nov. 3, 2021, as Appl. No. 17/517,971.
Prior Publication US 2023/0139234 A1, May 4, 2023
Int. Cl. H04N 25/46 (2023.01); G01S 7/481 (2006.01); G01S 17/894 (2020.01); H04N 25/44 (2023.01); H04N 25/441 (2023.01); H04N 25/705 (2023.01); H04N 25/75 (2023.01)
CPC H04N 25/46 (2023.01) [G01S 7/4816 (2013.01); G01S 17/894 (2020.01); H04N 25/44 (2023.01); H04N 25/441 (2023.01); H04N 25/705 (2023.01); H04N 25/75 (2023.01)] 42 Claims
OG exemplary drawing
 
1. A time-of-flight pixel array, comprising:
a plurality of photodiodes configured to generate charge in response to reflected modulated light incident upon the plurality of photodiodes;
a plurality of transfer transistors coupled to the plurality of photodiodes, wherein the plurality of transfer transistors includes a plurality of first transfer transistors and a plurality of second transfer transistors, wherein the plurality of first transfer transistors is configured to transfer a first portion of the charge from the plurality of photodiodes in response to a first modulation signal, wherein the plurality of second transfer transistors is configured to transfer a second portion of the charge from the plurality of photodiodes in response to a second modulation signal, wherein the second modulation signal is an inverted first modulation signal;
a plurality of floating diffusions, wherein the plurality of floating diffusions includes a plurality of first floating diffusions coupled to the plurality of first transfer transistors;
a plurality of binning transistors, wherein the plurality of binning transistors includes a plurality of first binning transistors, wherein a first one of the plurality of first binning transistors is coupled between a first one of the plurality of first floating diffusions and a second one of the plurality of first floating diffusions;
a plurality of sample and hold transistors, wherein the plurality of sample and hold transistors includes a plurality of first sample and hold transistors coupled to the plurality of first floating diffusions; and
a plurality of memory nodes, wherein the plurality of memory nodes includes a plurality of first memory nodes, wherein a first one of the plurality of first memory nodes is coupled to the first one of the plurality of first floating diffusions through a first one of the plurality of first sample and hold transistors, wherein a second one of the plurality of first memory nodes is coupled to the second one of the plurality of first floating diffusions through a second one of the plurality of first sample and hold transistors.