| CPC H01R 43/007 (2013.01) [H01R 13/2414 (2013.01); H01R 43/16 (2013.01); H01R 12/714 (2013.01); H01R 13/035 (2013.01); H01R 24/50 (2013.01); H01R 2201/20 (2013.01); Y10T 29/49204 (2015.01)] | 20 Claims |
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1. A method, comprising:
forming a dielectric structure, said structure comprising a first terminal surface, a second terminal surface and a through-hole that extends from said first terminal surface to said second terminal surface,
applying an electrically conductive material to at least a portion of said dielectric structure,
removing a first portion of said electrically conductive material from said first terminal surface, and
removing a second portion of said electrically conductive material from said second terminal surface,
a remaining portion of said electrically conductive material constituting at least an inner conductor of a first generally coaxial conductor pair and a first shielding conductor of said first generally coaxial conductor pair,
an intersection of a first imaginary plane and said inner conductor defining a first closed path,
an intersection of said first imaginary plane and said first shielding conductor defining a second closed path that circumscribes said first closed path, and
said inner conductor extending through said through-hole.
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