US 11,984,570 B2
Thermal management and/or EMI mitigation materials including coated fillers
Jason L. Strader, Cleveland, OH (US); and John Song, Barrington, IL (US)
Assigned to Laird Technologies, Inc., Chestefield, MO (US)
Filed by Laird Technologies, Inc., Chesterfield, MO (US)
Filed on Aug. 5, 2022, as Appl. No. 17/882,328.
Application 17/882,328 is a continuation of application No. 16/811,684, filed on Mar. 6, 2020, granted, now 11,411,263.
Claims priority of provisional application 62/908,289, filed on Sep. 30, 2019.
Claims priority of provisional application 62/908,284, filed on Sep. 30, 2019.
Claims priority of provisional application 62/814,605, filed on Mar. 6, 2019.
Claims priority of provisional application 62/814,610, filed on Mar. 6, 2019.
Prior Publication US 2022/0376322 A1, Nov. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01M 10/653 (2014.01); C04B 14/06 (2006.01); H01M 10/658 (2014.01); H01M 50/124 (2021.01); H01M 50/204 (2021.01); H01M 50/233 (2021.01); H01M 50/293 (2021.01); H05K 9/00 (2006.01)
CPC H01M 10/653 (2015.04) [C04B 14/06 (2013.01); H01M 10/658 (2015.04); H01M 50/124 (2021.01); H01M 50/1245 (2021.01); H01M 50/204 (2021.01); H01M 50/233 (2021.01); H01M 50/293 (2021.01); H05K 9/0045 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A thermal management and/or electromagnetic interference (EMI) mitigation material comprising filler and a coating on the filler, wherein the thermal management and/or EMI mitigation material is configured to be dispensable or pumpable and/or moldable such the thermal management and/or EMI mitigation material will temporarily hold a basic shape after being formed into the basic shape,
wherein the filler comprises particles coated with the coating that adhere to one another such that relatively small gaps or air pockets are defined between adjacent particles.