US 11,984,547 B2
Wiring board, and light emitting device and display device using same
Takashi Shimizu, Kusatsu (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 17/312,870
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Nov. 28, 2019, PCT No. PCT/JP2019/046599
§ 371(c)(1), (2) Date Jun. 10, 2021,
PCT Pub. No. WO2020/137342, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 2018-243165 (JP), filed on Dec. 26, 2018.
Prior Publication US 2022/0045250 A1, Feb. 10, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a substrate comprising a first surface, a second surface which is opposite to the first surface, and a side surface;
an electrode located at a portion of a side of the first surface;
an insulating layer disposed on the substrate; and
a side wiring disposed so as to extend from the electrode via the side surface to the second surface,
an end of the insulating layer with a cutaway portion extending in an inward direction of the insulating layer,
the electrode being disposed in an entrance-side part of the cutaway portion, and the cutaway portion comprising a bottom-side part constituting an inward area which is free of the electrode,
the electrode being entirely received in the cutaway portion.