US 11,984,531 B2
Light emitting device and wafer
KooHwa Lee, Daegu (KR); WooNam Jeong, Paju-si (KR); and HyeonHo Son, Goyang-si (KR)
Assigned to LG DISPLAY CO., LTD., Seoul (KR)
Filed by LG DISPLAY CO., LTD., Seoul (KR)
Filed on Jun. 22, 2021, as Appl. No. 17/354,671.
Claims priority of application No. 10-2020-0098843 (KR), filed on Aug. 6, 2020.
Prior Publication US 2022/0045238 A1, Feb. 10, 2022
Int. Cl. H01L 33/08 (2010.01); H01L 27/15 (2006.01); H01L 33/42 (2010.01)
CPC H01L 33/08 (2013.01) [H01L 27/156 (2013.01); H01L 33/42 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting device, comprising:
a first n-type semiconductor layer;
a first light emitting layer disposed on the first n-type semiconductor layer;
a first p-type semiconductor layer disposed on the first light emitting layer;
a second p-type semiconductor layer disposed on the first p-type semiconductor layer;
a bonding layer disposed between the first p-type semiconductor layer and the second p-type semiconductor layer;
a second light emitting layer disposed on the second p-type semiconductor layer;
a second n-type semiconductor layer disposed on the second light emitting layer;
a p-type electrode disposed on the second p-type semiconductor layer;
a first n-type electrode disposed on the first n-type semiconductor layer; and
a second n-type electrode disposed on the second n-type semiconductor layer,
wherein the second n-type electrode is disposed in a gap between the p-type electrode and the first n-type electrode in a plan view.