US 11,984,516 B2
Sensor package structure having ring-shaped solder mask frame
Fu-Chou Liu, Hsin-Chu County (TW); Jui-Hung Hsu, Hsin-Chu County (TW); Yu-Chiang Peng, Hsin-Chu County (TW); Chien-Chen Lee, Hsin-Chu County (TW); Ya-Han Chang, Hsin-Chu County (TW); and Li-Chun Hung, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed on Feb. 16, 2023, as Appl. No. 18/110,666.
Application 18/110,666 is a division of application No. 16/920,492, filed on Jul. 3, 2020, abandoned.
Claims priority of application No. 109110135 (TW), filed on Mar. 26, 2020.
Prior Publication US 2023/0197863 A1, Jun. 22, 2023
Int. Cl. H01L 31/02 (2006.01); H01L 31/0203 (2014.01)
CPC H01L 31/02002 (2013.01) [H01L 31/0203 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate having a first board surface and a second board surface that is opposite to the first board surface;
a sensor chip disposed on the first board surface and electrically coupled to the substrate, wherein a top surface of the sensor chip includes a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm;
a ring-shaped solder mask frame disposed on the first board surface of the substrate, wherein the ring-shaped solder mask frame surrounds and is spaced apart from the outer lateral side of the sensor chip, and wherein the ring-shaped solder mask frame includes a plurality of solder mask layers stacked and adhered together, and inner lateral sides of the solder mask layers are not coplanar with each other; and
a light permeable member having a first surface and a second surface that is opposite to the first surface and that is disposed on the ring-shaped solder mask frame, wherein the second surface of the light permeable member, the ring-shaped solder mask frame, and the sensor chip jointly define an enclosed space;
wherein an inner lateral side of the ring-shaped solder mask frame is in a step shape and has a plurality of step surfaces, the light permeable member is disposed on one of the step surfaces that is spaced apart from a top side of the ring-shaped solder mask frame, and the solder mask layers having the top side of the ring-shaped solder mask frame surrounds the light permeable member.