US 11,984,509 B2
Thin-film transistor, display device including the same, and method of manufacturing the same
SeHee Park, Paju-si (KR); JungSeok Seo, Paju-si (KR); PilSang Yun, Paju-si (KR); Jeyong Jeon, Paju-si (KR); Jaeyoon Park, Paju-si (KR); and ChanYong Jeong, Paju-si (KR)
Assigned to LG DISPLAY CO., LTD., Seoul (KR)
Filed by LG Display Co., Ltd., Seoul (KR)
Filed on Mar. 4, 2023, as Appl. No. 18/117,416.
Application 18/117,416 is a continuation of application No. 17/406,994, filed on Aug. 19, 2021, granted, now 11,621,356.
Application 17/406,994 is a continuation of application No. 16/705,767, filed on Dec. 6, 2019, granted, now 11,171,246, issued on Nov. 9, 2021.
Claims priority of application No. 10-2018-0165362 (KR), filed on Dec. 19, 2018.
Prior Publication US 2023/0207702 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 29/78 (2006.01); H01L 29/24 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01)
CPC H01L 29/7869 (2013.01) [H01L 29/24 (2013.01); H01L 29/4908 (2013.01); H01L 29/66742 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A thin-film transistor, comprising:
a base substrate;
a semiconductor layer on the base substrate, the semiconductor layer comprising:
a first oxide semiconductor layer; and
a second oxide semiconductor layer on the first oxide semiconductor layer;
a gate electrode spaced apart from the semiconductor layer and partially overlapping the semiconductor layer;
a gate insulating layer between the semiconductor layer and the gate electrode; and
a first mixture area between the first oxide semiconductor layer and the second oxide semiconductor layer,
wherein a concentration of gallium (Ga) in the second oxide semiconductor layer is higher than a concentration of gallium (Ga) in the first oxide semiconductor layer,
wherein the gate insulating layer comprises silicon and oxygen,
wherein the gate insulating layer comprises hydrogen (H) of 2 atom % or less in comparison with a total number of atoms of the gate insulating layer, and
wherein the first mixture area, the first oxide semiconductor layer, and the second oxide semiconductor layer are formed by metal-organic chemical vapor deposition (MOCVD).