US 11,984,500 B2
Structure and method of new power MOS and IGBT with built-in multiple VT'S
Min-Hwa Chi, Qingdao (CN); Dongyang Zhou, Qingdao (CN); Jinpeng Qiu, Qingdao (CN); Peng Li, Qingdao (CN); and Conghui Liu, Qingdao (CN)
Assigned to SiEn (QingDao) Integrated Circuits Co., Ltd., Qingdao (CN)
Filed by SiEn (QingDao) Integrated Circuits Co., Ltd., Shandong (CN)
Filed on Nov. 15, 2021, as Appl. No. 17/527,035.
Claims priority of application No. 202011633780.5 (CN), filed on Dec. 31, 2020.
Prior Publication US 2022/0209005 A1, Jun. 30, 2022
Int. Cl. H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); G11C 11/56 (2006.01); H03K 19/00 (2006.01)
CPC H01L 29/7813 (2013.01) [H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/7397 (2013.01); G11C 11/56 (2013.01); H03K 19/0027 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multiple-threshold-voltage (multi-Vt) vertical power device, comprising:
an epitaxial layer of a first conductivity type;
a well region of a second conductivity type, the well region of the second conductivity type being within the epitaxial layer of the first conductivity type;
a source region of the first conductivity type, the source region of the first conductivity type being within the well region of the second conductivity type;
trench gate structure, the trench gate structure comprising a gate dielectric layer and a gate conductive layer, the trench gate structure being within the epitaxial layer of the first conductivity type and passing through the source region of the first conductivity type and the well region of the second conductivity type; and
contact structures, passing through the source region of the first conductivity type to be in mutual contact with the well region of the second conductivity type, and comprising a contact portion of the second conductivity type;
wherein the contact structures form a contact structure array, the contact structure array has a shared trench gate structure and different traversal gaps between an edge of the contact portion of the second conductivity type and an edge of a trench, and
wherein in the contact structure array, the doping concentration in the gap region of the second conductivity type decreases along with increment of the traversal gaps.