US 11,984,460 B2
Insulation unit based on array substrate and manufacturing method thereof, array substrate and manufacturing method thereof, and electronic device
Yuming Xia, Shenzhen (CN); En-Tsung Cho, Shenzhen (CN); and Haijiang Yuan, Shenzhen (CN)
Assigned to BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., Beihai (CN); and HKC CORPORATION LIMITED, Shenzhen (CN)
Filed by Beihai HKC Optoelectronics Technology Co., Ltd., Beihai (CN); and HKC Corporation Limited, Shenzhen (CN)
Filed on Jun. 22, 2021, as Appl. No. 17/354,152.
Claims priority of application No. 202011009171.2 (CN), filed on Sep. 23, 2020.
Prior Publication US 2022/0093651 A1, Mar. 24, 2022
Int. Cl. H01L 27/12 (2006.01)
CPC H01L 27/1259 (2013.01) [H01L 27/1237 (2013.01); H01L 27/1248 (2013.01); H01L 27/127 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for manufacturing an insulation unit based on an array substrate, comprising:
providing an aluminum layer on a substrate;
anodizing the aluminum layer in a first electrolyte to oxidize the aluminum layer to form a barrier layer; and
placing the aluminum layer with the barrier layer in a second electrolyte for anodization, to partially oxidize the barrier layer to form a porous layer;
wherein the porous layer and an unoxidized portion of the barrier layer form the insulation unit.