US 11,984,429 B2
Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof
Yun Wei, Chandler, AZ (US); Scott Duncan Marshall, Chandler, AZ (US); Lakshminarayan Viswanathan, Chandler, AZ (US); Taek Kyu Kim, Chandler, AZ (US); Ricardo Uscola, Tempe, AZ (US); and Fernando A. Santos, Chandler, AZ (US)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on Sep. 30, 2021, as Appl. No. 17/491,309.
Prior Publication US 2023/0115340 A1, Apr. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H03F 3/213 (2006.01)
CPC H01L 25/0655 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 25/50 (2013.01); H03F 3/213 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A leadless power amplifier (PA) package, comprising:
a base flange having a die mount surface and a lower flange surface located opposite the die mount surface in a package height direction;
a first set of interposer mount pads spaced from the base flange;
a first radio frequency (RF) power die attached to the die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads;
a topside termination interposer (TTI) arrangement electrically coupled to the first set of interposer mount pads and projecting therefrom in the package height direction;
a package body enclosing the first RF power die and having a package topside surface opposite the lower flange surface, the package topside surface extending substantially parallel to the die mount surface; and
topside input/output (I/O) terminals accessible from the package topside surface and electrically interconnected with the first RF power die through the TTI arrangement and through the first set of interposer mount pads.