US 11,984,428 B2
Apparatuses and methods for coupling a plurality of semiconductor devices
Matthew B. Leslie, Boise, ID (US); Timothy M. Hollis, Boise, ID (US); and Roy E. Greeff, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by MICRON TECHNOLOGY, INC., Boise, ID (US)
Filed on Dec. 8, 2022, as Appl. No. 18/063,505.
Application 18/063,505 is a division of application No. 17/174,177, filed on Feb. 11, 2021, granted, now 11,527,508.
Claims priority of provisional application 62/984,738, filed on Mar. 3, 2020.
Prior Publication US 2023/0105886 A1, Apr. 6, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/0652 (2013.01) [H01L 25/50 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a memory array configured to store data;
a terminal;
an input/output circuit configured to receive data from the memory array and provide read data and receive write data to be stored in the memory array, wherein the input/output circuit is coupled to the terminal and configured to provide the read data to the terminal and configured to receive the write data from the terminal;
a command and address input circuit configured to receive command and address signals;
first and second bond pads; and
a U-shaped conductive structure coupled to the terminal and including a first portion extending between and coupled to the terminal and the first bond pad and further including a second portion extending between and coupled to the terminal and the second bond pad.