US 11,984,418 B2
Method of forming brass-coated metals in flip-chip redistribution layers
Vivek Swaminathan Sridharan, Dallas, TX (US); Christopher Daniel Manack, Flower Mound, TX (US); Nazila Dadvand, Sunnyvale, CA (US); Salvatore Frank Pavone, Houston, TX (US); and Patrick Francis Thompson, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Aug. 9, 2022, as Appl. No. 17/884,284.
Application 17/884,284 is a division of application No. 16/721,546, filed on Dec. 19, 2019, granted, now 11,410,947.
Prior Publication US 2022/0384375 A1, Dec. 1, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02317 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03502 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11424 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13618 (2013.01); H01L 2224/13647 (2013.01); H01L 2924/0132 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for manufacturing a package, comprising:
positioning a copper layer above a die;
positioning a zinc layer on the copper layer;
heating the zinc and copper layers to produce a brass layer, the brass layer abutting the copper layer; and
positioning a polymer layer abutting the brass layer.