US 11,984,414 B2
Packaging structure with antenna and manufacturing method thereof
Xianming Chen, Guangdong (CN); Lei Feng, Guangdong (CN); Wenshi Wang, Guangdong (CN); and Benxia Huang, Guangdong (CN)
Assigned to ZHUHAI ACCESS SEMICONDUCTOR CO., LTD, Zhuhai (CN)
Filed by Zhuhai ACCESS Semiconductor Co., Ltd, Guangdong (CN)
Filed on Jan. 26, 2022, as Appl. No. 17/584,722.
Claims priority of application No. 202110158558.2 (CN), filed on Feb. 5, 2021.
Prior Publication US 2022/0254741 A1, Aug. 11, 2022
Int. Cl. H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/561 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A packaging structure with an antenna, comprising:
a package, internally packaged with a first conducting through hole column and a second conducting through hole column;
an antenna circuit, disposed on a first surface and a sidewall of the package and at least partially covering the first surface and the sidewall of the package;
an interconnecting circuit, packaged in the package, and connected to the antenna circuit by the first conducting through hole column;
an outer-layer circuit, disposed on a second surface of the package, and connected to the interconnecting circuit by the second conducting through hole column, the outer-layer circuit being further connected to a conductive pin; and
a chip, packaged in the package, and connected to the interconnecting circuit or the outer-layer circuit;
wherein the antenna circuit located on the sidewall of the package has a step structure.