US 11,984,412 B2
Electronic package and manufacturing method thereof
Chih-Hsien Chiu, Taichung (TW); and Ko-Wei Chang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jan. 17, 2023, as Appl. No. 18/097,965.
Application 18/097,965 is a division of application No. 17/159,527, filed on Jan. 27, 2021, granted, now 11,587,892.
Claims priority of application No. 109132583 (TW), filed on Sep. 21, 2020.
Prior Publication US 2023/0154873 A1, May 18, 2023
Int. Cl. H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 28/10 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic package, comprising:
providing an electronic component having a first conductive layer and a carrier having a second conductive layer; and
disposing the electronic component on the carrier via a plurality of conductive bumps with at least one magnetically permeable member interposed between the electronic component and the carrier, wherein the plurality of conductive bumps are electrically connected with the first conductive layer and the second conductive layer, and the magnetically permeable member is located between the first conductive layer and the second conductive layer.