US 11,984,410 B2
Air channel formation in packaging process
Wan-Yu Lee, Taipei (TW); Chiang Lin, Taoyuan (TW); Yueh-Ting Lin, Taipei (TW); Hua-Wei Tseng, New Taipei (TW); Li-Hsien Huang, Zhubei (TW); and Yu-Hsiang Hu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 5, 2023, as Appl. No. 18/312,705.
Application 17/396,907 is a division of application No. 16/427,516, filed on May 31, 2019, granted, now 11,088,094, issued on Aug. 10, 2021.
Application 18/312,705 is a continuation of application No. 17/396,907, filed on Aug. 9, 2021, granted, now 11,682,637.
Prior Publication US 2023/0275040 A1, Aug. 31, 2023
Int. Cl. H01L 23/482 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/58 (2006.01)
CPC H01L 23/585 (2013.01) [H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1436 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a device die;
an encapsulant encapsulating the device die therein;
a plurality of dielectric layers overlying the encapsulant, wherein outmost edges of the plurality of dielectric layers are spaced apart from respective nearest edges of the package;
a plurality of metal rings, each contacting a sidewall of one of the plurality of dielectric layers, wherein upper ones of the plurality of metal rings are joined to respective lower ones of the plurality of metal rings, and wherein the upper ones of the plurality of metal rings are increasingly farther away from the respective nearest edges of the package than the lower ones of the plurality of metal rings; and
a plurality of redistribution lines in the plurality of dielectric layers to electrically couple to the device die.