US 11,984,391 B1
Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same
Anuya Reddy, Pleasanton, CA (US); Lyle Looney, Livermore, CA (US); and Darshan Shah, Milpitas, CA (US)
Assigned to Auradine, Inc., Santa Clara, CA (US)
Filed by Auradine, Inc., Santa Clara, CA (US)
Filed on Oct. 13, 2023, as Appl. No. 18/486,637.
Int. Cl. H01L 23/498 (2006.01); H01L 23/367 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/3675 (2013.01); H05K 3/0085 (2013.01); H05K 3/303 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A circuit board assembly comprising:
a circuit board;
a dielectric liquid in which the circuit board is immersed; and
a plurality of chips assembled on a surface of the circuit board, the plurality of chips comprising integrated circuit (IC) chips,
wherein at least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips,
wherein the plurality of chips is arranged in a plurality of columns, each column of the plurality of columns comprising a subset of the plurality of chips,
and wherein the subset of the plurality of chips in each column are placed adjacent to one another without intervening metallic spacers.