US 11,984,390 B2
Ball grid array underfilling systems
Eileen A. Bartley, South Glastonbury, CT (US)
Assigned to HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Apr. 5, 2021, as Appl. No. 17/222,809.
Application 17/222,809 is a division of application No. 15/902,809, filed on Feb. 22, 2018, granted, now 10,971,439.
Prior Publication US 2021/0225748 A1, Jul. 22, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/055 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 23/055 (2013.01); H01L 2924/15311 (2013.01); H05K 3/3436 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method of soldering a ball grid array (BGA) to a printed circuit board (PCB), comprising:
heating an underflow material within a cavity defined between a cover and a first side of a component substrate;
flowing the underflow material through at least one channel in the component substrate to a gap defined between a second side of the component substrate and the PCB, the gap including a plurality of solder balls; and
soldering the second side to the PCB.