US 11,984,379 B2
Electronic package and manufacturing method thereof
Yu-Lung Huang, Taichung (TW); Chih-Ming Huang, Taichung (TW); Kuo-Hua Yu, Taichung (TW); and Chang-Fu Lin, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jul. 8, 2021, as Appl. No. 17/370,207.
Claims priority of application No. 110120987 (TW), filed on Jun. 9, 2021.
Prior Publication US 2022/0399245 A1, Dec. 15, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4871 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 24/73 (2013.01); H01L 2224/73204 (2013.01)] 26 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a carrier structure;
an electronic component disposed on the carrier structure;
a heat dissipating body disposed on the electronic component in a loop, wherein the heat dissipating body is formed with at least one regulating channel having a gas segment;
a heat sink disposed on the heat dissipating body, wherein the electronic component, the heat dissipating body and the heat sink form a receiving space; and
a heat dissipating material formed in the receiving space and in contact with the heat sink and the electronic component, wherein a fluid regulating space is formed between the heat dissipating material and the heat dissipating body, and the gas segment interconnects the fluid regulating space with an outside of the heat dissipating body,
wherein the regulating channel further includes a fluid segment formed on an inner loop surface, and wherein the fluid segment is in communication with the gas segment in a tapered fashion that narrows towards the gas segment, such that the fluid segment defines the fluid regulating space.