| CPC H01L 23/3114 (2013.01) [H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 33/52 (2013.01)] | 13 Claims |
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1. A package for an integrated circuit, comprising:
a support substrate including first and second conductive zones at a top surface;
at least one electronic chip mounted to the top surface of the support substrate;
an encapsulation hood fastened directly onto the top surface of the support substrate by a fastening device, wherein the encapsulation hood incorporates an electrically conductive path having at least two distinct ends;
wherein the fastening device comprises:
at least two springs respectively electrically coupling the two ends of the electrically conductive path at the encapsulation hood to the first and second electrically conductive zones at the top surface of the support substrate, each spring having as a first free region in contact with one of said at least two distinct ends of the electrically conductive path at the encapsulation hood or one of said first and second electrically conductive zones and a second region fastened onto another of said first and second electrically conductive zone or another of said at least two distinct ends of the electrically conductive path at the encapsulation hood, respectively; and
an electrically insulating auxiliary attachment disposed between the springs and configured to fasten a part of the encapsulation hood located between the ends of said at least one conductive path onto the top surface of the support substrate.
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