US 11,984,366 B2
Measurement device and method for semiconductor structure
Xin Huang, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed on Oct. 25, 2021, as Appl. No. 17/509,126.
Application 17/509,126 is a continuation of application No. PCT/CN2021/117062, filed on Sep. 8, 2021.
Claims priority of application No. 202110832798.6 (CN), filed on Jul. 22, 2021.
Prior Publication US 2023/0024724 A1, Jan. 26, 2023
Int. Cl. G01N 21/88 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01); H01L 21/687 (2006.01)
CPC H01L 22/12 (2013.01) [G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); H01L 21/68728 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A measurement device for a semiconductor structure, comprising:
a bearing platform;
a clamping mechanism installed on the bearing platform and comprising a clamp disposed along a vertical direction, the clamp being configured to clamp the semiconductor structure such that the semiconductor structure is clamped with a to-be-measured surface facing a side of the clamping mechanism;
a perpendicularity detection device, configured to detect a perpendicularity of a back surface of the semiconductor structure relative to a horizontal plane, wherein the back surface is a surface of the semiconductor structure facing away from the to-be-measured surface, and wherein the clamp is configured to: in response to the back surface of the semiconductor structure being not perpendicular to the horizontal plane, adjust a position of the semiconductor structure clamped by the clamp so that the back surface of the semiconductor structure is perpendicular to the horizontal plane; and
an image acquisition system disposed by the side of the clamping mechanism and configured to acquire a three-dimensional morphology of the semiconductor structure from the side.