US 11,984,345 B2
Substrate processing apparatus and driving method thereof
Ilyoung Han, Uiwang-si (KR); Hunyong Park, Seoul (KR); Sohee Han, Hwaseong-si (KR); and Nohsung Kwak, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 14, 2023, as Appl. No. 18/135,017.
Application 18/135,017 is a division of application No. 16/712,413, filed on Dec. 12, 2019, granted, now 11,651,990.
Claims priority of application No. 10-2019-0080129 (KR), filed on Jul. 3, 2019.
Prior Publication US 2023/0253236 A1, Aug. 10, 2023
Int. Cl. H01L 21/687 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/68785 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A substrate processing apparatus including:
a chamber;
a chuck disposed in the chamber, and the chuck including a plurality of pin holes;
a plurality of lift pins positioned to rise and fall through the plurality of pin holes;
a lift plate configured to raise and lower the plurality of lift pins,
a first lift pin included among the plurality of lift pins, the first lift pin having a rod shape, the first lift pin being configured to move up and down within a pin hole of the plurality of pin holes;
a first metal plate disposed below the first lift pin;
a weight block having a first magnet disposed on top, the weight block coupled to a lower portion of the first lift pin;
a weight body positioned beneath the lift plate; and
a weight string connecting the weight block and the weight body,
wherein the lift plate includes a string hole through which the weight string is configured to pass through.