US 11,984,342 B2
Info structure with copper pillar having reversed profile
Hsi-Kuei Cheng, Zhubei (TW); Ching Fu Chang, Taipei (TW); Chih-Kang Han, Hsinchu (TW); and Hsin-Chieh Huang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Mar. 15, 2021, as Appl. No. 17/201,284.
Application 15/894,523 is a division of application No. 15/390,226, filed on Dec. 23, 2016, granted, now 9,922,896, issued on Mar. 20, 2018.
Application 17/201,284 is a continuation of application No. 16/410,183, filed on May 13, 2019, granted, now 10,950,478.
Application 16/410,183 is a continuation of application No. 15/894,523, filed on Feb. 12, 2018, granted, now 10,290,530, issued on May 14, 2019.
Claims priority of provisional application 62/395,528, filed on Sep. 16, 2016.
Prior Publication US 2021/0202290 A1, Jul. 1, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); H01L 21/288 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/6835 (2013.01) [H01L 21/288 (2013.01); H01L 21/31058 (2013.01); H01L 21/311 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/76834 (2013.01); H01L 21/76885 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/94 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/014 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/351 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a device die comprising:
a metal pad;
a first polymer layer covering edge portions of the metal pad; and
a metal pillar extending into the first polymer layer, wherein a first sidewall of the first polymer layer contacts a second sidewall of metal pillar to form a first interface;
an encapsulant encapsulating the device die therein;
a second polymer layer over the encapsulant and the device die; and
a redistribution line having a via portion extending into the second polymer layer, wherein the via portion comprises a third sidewall contacting a fourth sidewall of the second polymer layer to form a second interface, and wherein the first interface is more curved than the second interface.