supplying a direct current (DC) power to heating elements embedded in each of a plurality of zones of a substrate support assembly included in a processing chamber;

determining, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that a temperature of the substrate support assembly does not satisfy a temperature condition associated with a process recipe for a process at the processing chamber;

identifying, based on the measured voltage and measured current across the heating elements, a zone of the plurality of zones that is at a temperature that does not correspond to a target temperature for the zone based on the temperature condition; and

modifying the DC power supplied to the heating elements embedded within the identified zone to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.