US 11,984,330 B2
Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scanner
Dong Woo Paeng, Albany, CA (US); Yunsang S. Kim, Monte Sereno, CA (US); He Zhang, Fremont, CA (US); Keith Wells, Santa Cruz, CA (US); and Alan M. Schoepp, Ben Lomond, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 17/053,110
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed May 2, 2019, PCT No. PCT/US2019/030304
§ 371(c)(1), (2) Date Nov. 5, 2020,
PCT Pub. No. WO2019/217180, PCT Pub. Date Nov. 14, 2019.
Claims priority of provisional application 62/767,574, filed on Nov. 15, 2018.
Claims priority of provisional application 62/668,552, filed on May 8, 2018.
Prior Publication US 2021/0143032 A1, May 13, 2021
Int. Cl. H01L 21/67 (2006.01); C23C 16/455 (2006.01); G02B 27/09 (2006.01); G02B 27/30 (2006.01); G02F 1/11 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/67115 (2013.01) [C23C 16/45544 (2013.01); G02B 27/0927 (2013.01); G02B 27/0944 (2013.01); G02B 27/0955 (2013.01); G02B 27/30 (2013.01); G02F 1/11 (2013.01); H01J 37/321 (2013.01); H01J 37/32449 (2013.01); H01J 37/32715 (2013.01); H01L 21/67069 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a processing chamber;
a substrate support disposed in the processing chamber and configured to support a substrate;
a laser configured to generate a laser beam;
a collimating assembly comprising a plurality of lenses or mirrors arranged to direct the laser beam at the substrate to heat an exposed material of the substrate, wherein the plurality of lenses or mirrors are configured to direct the laser beam in a direction within a predetermined range of being perpendicular to a surface of the substrate; and
a controller configured to perform a rapid thermal annealing process including (i) generating a control signal to modulate the laser beam to subiect the exposed material to a plurality of thermal energy pulses, and (ii) allowing the exposed material to cool between consecutive ones of the plurality of thermal enemy pulses.