US 11,984,327 B2
Method for producing power module, and power module
Naoyuki Kushihara, Annaka (JP); Kazuaki Sumita, Annaka (JP); and Masahiro Kaneta, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed on Aug. 12, 2021, as Appl. No. 17/400,193.
Claims priority of application No. 2020-144661 (JP), filed on Aug. 28, 2020.
Prior Publication US 2022/0068667 A1, Mar. 3, 2022
Int. Cl. H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/565 (2013.01) [H01L 23/24 (2013.01); H01L 23/3121 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for producing a power module, comprising processes (1) to (4) in the following order of steps:
(1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with a plurality of semiconductor components mounted thereon;
(2) a melt process involving
disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and
heating the container to melt the thermosetting resin composition;
(3) a pressurization-depressurization process of performing a depressurization step followed by a pressurization step inside the molding apparatus; and
(4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition.