US 11,984,269 B2
Ceramic electronic component
Won Hee Yoo, Suwon-si (KR); Min Seop Kim, Suwon-si (KR); Jin Man Jung, Suwon-si (KR); and Hyo Joong Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 11, 2022, as Appl. No. 17/669,677.
Claims priority of application No. 10-2021-0167099 (KR), filed on Nov. 29, 2021.
Prior Publication US 2023/0170148 A1, Jun. 1, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/248 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A ceramic electronic component, comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body,
wherein a first carbon material is disposed in the internal electrode and a second carbon material different from the first carbon material is disposed at an interface between the dielectric layer and the internal electrode, and
wherein the first carbon material forms a plurality of cluster channels connected to each other or a plurality of cluster spots spaced apart from each other within the internal electrode and the second carbon material forms a plurality of cluster channels at the interface between the dielectric layer and the internal electrode.