US 11,984,264 B2
Multilayer electronic component
Jin Bok Shin, Suwon-si (KR); Yu Ra Shin, Suwon-si (KR); Seung Yong Lee, Suwon-si (KR); Jung Hyun An, Suwon-si (KR); Yong Hwa Lee, Suwon-si (KR); Da Hyeon Go, Suwon-si (KR); Choong Seop Jeon, Suwon-si (KR); and Min Soo Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 27, 2021, as Appl. No. 17/512,063.
Claims priority of application No. 10-2020-0189099 (KR), filed on Dec. 31, 2020.
Prior Publication US 2022/0208452 A1, Jun. 30, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1209 (2013.01) [H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and
external electrodes disposed on the body,
wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and
Gn/Pn is in a range from 12 to 29, in which Gn is number of dielectric grains included in the cover portion and Pn is number of pores included in the cover portion.