US 11,983,583 B2
Multilayer chip component
Gaku Echigoya, Tokyo (JP); Hiroshi Satou, Tokyo (JP); Keijiro Ishida, Tokyo (JP); and Hajime Kudo, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Apr. 4, 2023, as Appl. No. 18/130,452.
Application 18/130,452 is a continuation of application No. 17/166,052, filed on Feb. 3, 2021, granted, now 11,645,480.
Claims priority of application No. 2020-018693 (JP), filed on Feb. 6, 2020.
Prior Publication US 2023/0237285 A1, Jul. 27, 2023
Int. Cl. G06K 1/12 (2006.01); G06K 19/06 (2006.01); H01G 4/002 (2006.01)
CPC G06K 1/12 (2013.01) [H01G 4/002 (2013.01); G06K 19/06037 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A multilayer chip component comprising an element body provided with a code including a plurality of dot-shaped recesses arranged on a main surface of the element body and having a surface layer constituting the main surface and a functioning layer positioned inside the element body, and a depth of each of the dot-shaped recesses is shorter than a thickness of the surface layer.