US 11,983,135 B2
Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge
Dheeraj Subbareddy, Portland, OR (US); Ankireddy Nalamalpu, Portland, OR (US); Anshuman Thakur, Beaverton, OR (US); Md Altaf Hossain, Portland, OR (US); Mahesh Kumashikar, Bangalore (IN); Kemal Aygün, Tempe, AZ (US); Casey Thielen, Chandler, AZ (US); Daniel Klowden, Portland, OR (US); and Sandeep B. Sane, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 25, 2020, as Appl. No. 17/033,593.
Prior Publication US 2022/0100692 A1, Mar. 31, 2022
Int. Cl. G06F 13/42 (2006.01); G06F 30/30 (2020.01); G06F 30/347 (2020.01)
CPC G06F 13/4221 (2013.01) [G06F 13/4282 (2013.01); G06F 30/30 (2020.01); G06F 30/347 (2020.01); G06F 2213/0026 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a substrate having a first side and a second side opposite the first side;
a first optical file die on the first side of the substrate, wherein an edge of the first optical tile die is at a first edge of the substrate;
a second die on the first side of the substrate and electrically coupled with the first optical tile die, wherein a first set of one or more optical couplings of the first optical tile die are at the first edge of the substrate at a first Z-height representing a distance from the second side of the substrate, and wherein one or more electrical couplings of the second die extend into the substrate to the first edge of the substrate at a second Z-height representing a distance from the second side of the substrate; and
a second optical tile die on the first side of the substrate, wherein an edge of the second optical tile die is at a second edge of the substrate, wherein the second optical tile die is electrically coupled to the second die, wherein a second set of one or more optical couplings of the second optical tile die are at the second edge of the substrate at a third Z-height representing a distance from the second side of the substrate.