US 11,982,778 B2
Silicon photomultipliers with split microcells
Brian Patrick McGarvey, Templemartin (IE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jul. 20, 2022, as Appl. No. 17/813,872.
Application 17/813,872 is a continuation of application No. 16/670,527, filed on Oct. 31, 2019, granted, now 11,428,826.
Claims priority of provisional application 62/897,649, filed on Sep. 9, 2019.
Prior Publication US 2022/0350041 A1, Nov. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); G01T 1/24 (2006.01); H01L 31/02 (2006.01); H01L 31/107 (2006.01)
CPC G01T 1/248 (2013.01) [G01T 1/247 (2013.01); H01L 27/1463 (2013.01); H01L 27/14636 (2013.01); H01L 27/14658 (2013.01); H01L 31/02027 (2013.01); H01L 31/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate;
a first single-photon avalanche diode in the substrate;
a second single-photon avalanche diode in the substrate;
a first isolation structure formed between the first and second single-photon avalanche diodes; and
a second isolation structure that is different from the first isolation structure formed around a periphery of the first and second single-photon avalanche diodes.