US 11,982,650 B2
Method for testing interfacial tribochemical reaction between abrasive and diamond wafer
Xipeng Xu, Xiamen (CN); Jing Lu, Xiamen (CN); Qiufa Luo, Xiamen (CN); Yueqin Wu, Xiamen (CN); Dekui Mu, Xiamen (CN); and Zhiping Xue, Xiamen (CN)
Assigned to HUAQIAO UNIVERSITY, Fujian (CN)
Filed by HUAQIAO UNIVERSITY, Fujian (CN)
Filed on Aug. 7, 2023, as Appl. No. 18/231,128.
Application 18/231,128 is a continuation of application No. PCT/CN2021/143449, filed on Dec. 31, 2021.
Claims priority of application No. 202110323147.4 (CN), filed on Mar. 25, 2021; and application No. 202110323211.9 (CN), filed on Mar. 25, 2021.
Prior Publication US 2023/0384194 A1, Nov. 30, 2023
Int. Cl. G01N 3/54 (2006.01)
CPC G01N 3/54 (2013.01) [G01N 2203/0078 (2013.01); G01N 2203/0226 (2013.01); G01N 2203/0298 (2013.01); G01N 2203/0641 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for testing an interfacial tribochemical reaction between abrasive and a diamond wafer, comprising:
(1) coating a layer of active metal abrasive or a layer of metal oxide abrasive on a tip surface of a diamond indenter of a nano scratch tester by magnetron sputtering;
(2) installing the diamond indenter with the layer of the active metal abrasive or the layer of the metal oxide abrasive on the nano scratch tester, scratching a surface of the diamond wafer using the diamond indenter to enable the surface of the diamond wafer to react with the active metal abrasive or the metal oxide abrasive, and obtaining a scratched diamond wafer, wherein:
a lubricating medium for the scratching is deionized water, and
a temperature of the lubricating medium is 40-90° C.; and
(3) putting the scratched diamond wafer on a scanning probe micro Raman spectrometer, and analyzing chemical components of a scratching section of the scratched diamond wafer.