US 11,981,989 B2
Automated temperature controlled substrate support
Robert Hartwig, San Jose, CA (US); Dinkesh Huderi Somanna, San Jose, CA (US); and Brian T. West, San Jose, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 3, 2021, as Appl. No. 17/337,528.
Prior Publication US 2022/0389566 A1, Dec. 8, 2022
Int. Cl. C23C 14/54 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); F28F 27/02 (2006.01); H01J 37/32 (2006.01)
CPC C23C 14/541 (2013.01) [C23C 14/34 (2013.01); C23C 14/50 (2013.01); F28F 27/02 (2013.01); H01J 37/32724 (2013.01); H01J 2237/002 (2013.01); H01J 2237/332 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling apparatus for use with a substrate support of a processing chamber, comprising:
a heat exchanger;
a manifold assembly comprising a first input configured to connect to an output of the heat exchanger, a second input configured to connect to a first coolant supply configured to supply a first coolant, a first output configured to connect to the substrate support of the processing chamber, and a second output configured to connect to an input of the heat exchanger;
a gas input configured to connect to a second coolant supply that is configured to supply a second coolant that is different from the first coolant to the substrate support;
a first three-way valve comprising a first input connected to the first output of the manifold assembly for receiving the first coolant, a second input connected to the gas input for receiving the second coolant, and a common output that supplies the first coolant and the second coolant to the substrate support; and
a controller configured to control supplying one of the first coolant or the second coolant during operation.