US 11,981,833 B2
Polishing composition for semiconductor wiring
Yuichi Sakanishi, Tokyo (JP)
Assigned to DAICEL CORPORATION, Osaka (JP)
Appl. No. 17/262,088
Filed by DAICEL CORPORATION, Osaka (JP)
PCT Filed Mar. 18, 2020, PCT No. PCT/JP2020/011996
§ 371(c)(1), (2) Date Jan. 21, 2021,
PCT Pub. No. WO2020/196162, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-054531 (JP), filed on Mar. 22, 2019.
Prior Publication US 2021/0292602 A1, Sep. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C09G 1/02 (2006.01); H01L 21/304 (2006.01)
CPC C09G 1/02 (2013.01) [H01L 21/304 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing composition for semiconductor wiring comprising a compound represented by Formula (1) below:
R1O—(C3H6O2)n—H  (1)
where R1 represents an alkynyl group having from 5 to 20 carbon atoms, or a group represented by R2CO, where the R2 represents an alkynyl group having from 5 to 20 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.