US 11,981,137 B2
Method for producing liquid-ejection head substrate
Kazuaki Shibata, Kanagawa (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 16, 2022, as Appl. No. 17/696,147.
Claims priority of application No. 2021-047215 (JP), filed on Mar. 22, 2021.
Prior Publication US 2022/0297432 A1, Sep. 22, 2022
Int. Cl. B41J 2/16 (2006.01)
CPC B41J 2/1628 (2013.01) [B41J 2/164 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for producing a liquid-ejection head substrate, the method comprising:
preparing a substrate including a heating resistor and a cavitation resistant film including a portion provided at a position where the heating resistor is covered, a surface of the portion being exposed to an outside;
forming a protective film covering the surface of the portion of the cavitation resistant film with a metallic material containing at least one of titanium, tungsten, and titanium-tungsten;
etching the substrate after forming the protective film; and
removing the protective film after the etching.