US 11,980,998 B2
Polishing device, polishing method, and recording medium for recording program for determining supply position of polishing liquid
Itsuki Kobata, Tokyo (JP); Takashi Yamazaki, Tokyo (JP); Ryuichi Kosuge, Tokyo (JP); and Tadakazu Sone, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Feb. 20, 2020, as Appl. No. 16/796,903.
Claims priority of application No. 2019-029543 (JP), filed on Feb. 21, 2019.
Prior Publication US 2020/0269385 A1, Aug. 27, 2020
Int. Cl. B24B 57/02 (2006.01); B24B 37/005 (2012.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01); B24D 13/14 (2006.01); B24D 13/20 (2006.01)
CPC B24B 57/02 (2013.01) [B24B 37/005 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); B24D 13/147 (2013.01); B24D 13/20 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A polishing device comprising:
a polishing pad;
a top ring which presses a substrate against the polishing pad to polish the substrate;
a liquid injection nozzle which injects a polishing liquid in a fan shape on the polishing pad;
a nozzle moving device which moves the liquid injection nozzle in a radial direction of the polishing pad; and
an operation control unit configured to control an operation of the nozzle moving device,
wherein the operation control unit comprises a storage device which stores instructions,
which when executed by a processing device, causes the processing device to:
obtain a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of a polishing rate within the substrate;
determine a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate, wherein the movable range of the liquid injection nozzle is determined according to supply positions of the liquid injection nozzle whose average polishing rates are within the predetermined range of the allowable average polishing rate;
determine an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and
cause the nozzle moving device to move the liquid injection nozzle to the determined supply position to polish the substrate.