US 11,980,975 B2
Processing system, processing method, and storage medium
Masahiro Saito, Yokohama (JP); and Hiromasa Takahashi, Minato (JP)
Assigned to KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Sep. 10, 2020, as Appl. No. 17/017,308.
Claims priority of application No. 2019-173466 (JP), filed on Sep. 24, 2019; and application No. 2020-136918 (JP), filed on Aug. 14, 2020.
Prior Publication US 2021/0086282 A1, Mar. 25, 2021
Int. Cl. B23K 31/00 (2006.01); B23K 9/095 (2006.01); B23K 31/12 (2006.01); G06T 7/00 (2017.01)
CPC B23K 9/0953 (2013.01) [B23K 9/0956 (2013.01); B23K 31/125 (2013.01); G06T 7/0004 (2013.01); G06T 2207/10132 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A processing device, being configured to:
acquire a detection result when a reflected wave is detected by a detector, the detector including a plurality of detection elements arranged in a first direction, the detector transmitting an ultrasonic wave toward a welding object and detecting the reflected wave;
extract a portion from the detection result in which a multiple-reflection wave is detected; and
perform at least a first determination of determining whether or not the detector contacts the welding object, the first determination being based on the reflected wave in the extracted portion.