US 11,980,971 B2
Laser processing apparatus and laser processing method
Yuki Saeki, Kanagawa (JP)
Assigned to VIA MECHANICS, LTD., Kanagawa (JP)
Filed by Via Mechanics, Ltd., Kanagawa (JP)
Filed on Dec. 23, 2020, as Appl. No. 17/132,987.
Claims priority of application No. 2019-232313 (JP), filed on Dec. 24, 2019.
Prior Publication US 2021/0187667 A1, Jun. 24, 2021
Int. Cl. B23K 26/382 (2014.01); B23K 26/00 (2014.01); B23K 26/04 (2014.01); B23K 26/046 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/082 (2014.01)
CPC B23K 26/382 (2015.10) [B23K 26/0006 (2013.01); B23K 26/043 (2013.01); B23K 26/046 (2013.01); B23K 26/0622 (2015.10); B23K 26/064 (2015.10); B23K 26/082 (2015.10)] 4 Claims
OG exemplary drawing
 
1. A laser processing apparatus comprising:
a laser oscillator configured to output a laser pulse;
a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and
a controller configured to control the laser oscillator and the laser deflector,
the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece,
wherein an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector, and
wherein the controller changes the focal point of the laser pulse stepwise in one direction by applying a stepwise voltage to the electrooptic device.