US 11,980,967 B2
Laser micromachining with tailored bursts of short laser pulses
Yunlong Sun, Beaverton, OR (US)
Assigned to ELECTRO SCIENTIFIC INDUSTRIES, INC., Beaverton, OR (US)
Filed by Electro Scientific Industries, Inc., Portland, OR (US)
Filed on May 1, 2019, as Appl. No. 16/400,792.
Application 16/400,792 is a continuation of application No. 12/413,350, filed on Mar. 27, 2009, granted, now 10,307,862.
Prior Publication US 2019/0299329 A1, Oct. 3, 2019
Int. Cl. B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/16 (2006.01)
CPC B23K 26/0624 (2015.10) [B23K 26/0622 (2015.10); B23K 26/40 (2013.01); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/172 (2018.08); B23K 2103/30 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/52 (2018.08)] 5 Claims
OG exemplary drawing
 
1. A laser micromachining method comprising:
generating, using an ultrafast laser source, a burst of laser pulses;
adjusting respective amplitudes of individual laser pulses within the burst of laser pulses, using a high-speed optical modulator, to produce a selectively shaped single burst envelope for processing a target location of a single material workpiece, the workpiece having a top surface of material, a inner portion of material, and a bottom surface of material, wherein each of the top surface of material, inner portion of material, and bottom surface of material each have different laser processing characteristics, the adjusting comprising:
selectively adjusting one or more first laser pulses within the single burst envelope to a first amplitude based on processing characteristics of the top surface of the material at a target location;
selectively adjusting one or more second laser pulses within the single burst envelope to a second amplitude based on processing characteristics of the inner portion of the material at a target location;
selectively adjusting one or more second laser pulses within the single burst envelope to a second amplitude based on processing characteristics of the bottom surface of the material at a target location; and
directing the amplitude adjusted burst of laser pulses to the target location, the single burst envelope of laser pulses processing the top surface of the material, inner portion of the material, and bottom surface of the material layer at the same target location.