US 11,980,724 B2
Electrical arrangements for sensor assemblies in electromagnetic navigation systems
Steven J. Meyer, Lake Elmo, MN (US); James E. Blood, Shoreview, MN (US); David A. Chizek, Brooklyn Park, MN (US); Matthew Hein, Eden Prairie, MN (US); and Daniel J. Foster, Lino Lakes, MN (US)
Assigned to Boston Scientific Scimed, Inc., Maple Grove, MN (US)
Filed by Boston Scientific Scimed Inc., Maple Grove, MN (US)
Filed on Sep. 20, 2021, as Appl. No. 17/480,086.
Application 17/480,086 is a continuation of application No. 16/248,352, filed on Jan. 15, 2019, granted, now 11,141,567.
Claims priority of provisional application 62/617,925, filed on Jan. 16, 2018.
Prior Publication US 2022/0001140 A1, Jan. 6, 2022
Int. Cl. A61M 25/01 (2006.01); A61B 5/00 (2006.01); A61B 5/06 (2006.01); A61M 25/00 (2006.01); G01B 7/004 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 7/14 (2006.01)
CPC A61M 25/0127 (2013.01) [A61B 5/062 (2013.01); A61B 5/6852 (2013.01); A61M 25/0012 (2013.01); G01B 7/004 (2013.01); H05K 1/028 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 7/1427 (2013.01); A61B 5/6851 (2013.01); A61B 5/686 (2013.01); A61B 2562/0223 (2013.01); A61B 2562/043 (2013.01); A61B 2562/164 (2013.01); A61M 2025/0166 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10151 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system comprising:
a sensor assembly including:
a multilayer circuit including a proximal section, a distal section, and a longitudinal axis, the proximal section including a plurality of electrical pads,
a first magnetic field sensor coupled to the multilayer circuit at the distal section and having a primary sensing direction aligned with the longitudinal axis,
a second magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis,
a housing surrounding the multilayer circuit, the first magnetic sensor, and the second magnetic sensor, the housing having a diameter of between 0.45 mm and 0.55 mm and a length of between 4 mm and 5 mm; and
wherein the multilayer circuit includes a flexible substrate layer, wherein a first subset of the plurality of electrical pads is positioned on a first major surface of the flexible substrate layer, and wherein a second subset of the plurality of electrical pads is positioned on a second major surface of the flexible substrate layer opposite the first major surface,
wherein the flexible substrate layer is disposed between the first subset of the plurality of electrical pads on the first major surface and the second subset of the plurality of electrical pads on the second major surface on an axis perpendicular to the flexible substrate.