US 12,302,742 B2
Display device including bonding member
Jun Su Park, Seoul (KR); Young Do Kim, Cheonan-si (KR); Young Moon Kim, Asan-si (KR); Kyung Lae Rho, Suwon-si (KR); Young Gil Park, Asan-si (KR); Ji Hye Seo, Cheonan-si (KR); Ki Cheol Song, Suwon-si (KR); Na Ri Ahn, Seongnam-si (KR); and Jang Doo Lee, Hwaseong-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Nov. 2, 2023, as Appl. No. 18/500,543.
Application 18/500,543 is a continuation of application No. 17/872,070, filed on Jul. 25, 2022, granted, now 11,844,265.
Application 17/872,070 is a continuation of application No. 16/658,857, filed on Oct. 21, 2019, granted, now 11,430,963, issued on Aug. 30, 2022.
Claims priority of application No. 10-2019-0019405 (KR), filed on Feb. 19, 2019.
Prior Publication US 2024/0065087 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 77/10 (2023.01); B32B 7/12 (2006.01); B32B 17/10 (2006.01); G06F 3/041 (2006.01); H10K 50/84 (2023.01); H10K 50/86 (2023.01); H10K 50/87 (2023.01); H10K 59/12 (2023.01); H10K 59/40 (2023.01); H10K 102/00 (2023.01)
CPC H10K 77/111 (2023.02) [B32B 7/12 (2013.01); B32B 17/10027 (2013.01); B32B 17/10458 (2013.01); H10K 50/841 (2023.02); H10K 50/86 (2023.02); H10K 50/87 (2023.02); H10K 59/12 (2023.02); H10K 59/40 (2023.02); B32B 2307/42 (2013.01); B32B 2307/546 (2013.01); B32B 2457/208 (2013.01); G06F 3/0412 (2013.01); G06F 2203/04102 (2013.01); H10K 2102/311 (2023.02)] 12 Claims
OG exemplary drawing
 
1. A display device comprising:
a display panel including a first surface and a second surface opposite to each other, the display panel being configured to be folded;
a cover window on the first surface of the display panel;
a first film on the cover window;
a second film on the second surface of the display panel;
a first bonding layer between the cover window and the first film; and
a second bonding layer between the display panel and the second film,
wherein the first bonding layer has a first indenter-measured modulus, the second bonding layer has a second indenter-measured modulus, and the second indenter-measured modulus is at least 2 times and at most 20 times the first indenter-measured modulus.