| CPC H10H 20/857 (2025.01) [H10H 20/814 (2025.01); H10H 20/841 (2025.01); H10H 29/142 (2025.01)] | 20 Claims |
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1. A light emitting module, comprising:
a printed circuit board;
a light emitting device disposed on the printed circuit board and including a light source; and
a diffuser disposed on the light emitting device,
wherein the light source includes:
a first conductivity type semiconductor layer;
a mesa disposed on the first conductivity type semiconductor layer and including an active layer and a second conductivity type semiconductor layer; and
a transparent conductive oxide layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
a metal reflection layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer; and
a dielectric layer disposed between the second conductivity type semiconductor layer and the metal reflection layer, and
wherein the active layer generates light having a peak wavelength of about 500 nm or less;
wherein the second conductivity type semiconductor layer includes an impurity having a concentration profile including a region that a concentration of the impurity varies along a thickness direction,
wherein the metal reflection layer includes a region spaced apart from a surface of the second conductivity type semiconductor layer by the dielectric layer including a region having a thickness in a range between 200 nm and 1000 nm.
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